Notice: Function _load_textdomain_just_in_time was called incorrectly. Translation loading for the wordpress-seo domain was triggered too early. This is usually an indicator for some code in the plugin or theme running too early. Translations should be loaded at the init action or later. Please see Debugging in WordPress for more information. (This message was added in version 6.7.0.) in /var/www/html/wp-includes/functions.php on line 6260 Nestle Featured at RadTech Packaging Event - Ink World Magazine

What are you searching for?

Sign in
Industry News

Nestle Featured at RadTech Packaging Event

Nestle headlining a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications at RadTech 2012

Author Image

By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Dr. Stephen P. Klump, Nestlé Quality Assurance Center, is headlining a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications, at RadTech 2012, April 30 in Chicago, IL.

At the event, Dr. Klump will address Nestlé’s Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks. In addition to Dr. Klump, issues presented at the event include global and regional regulatory requirements, new materials, EB technologies, and UV inkjet for flexible packaging and labels.

RadTech 2012 also features a technology exhibition and special sessions on sustainability, LEDs, and EHS basics for UV/EB. End users of UV and/or EB may be eligible for discounted or free admission to the event. Please visit www.radtech2012.com for details.

Add us as a preferred source on Google

Get the latest Ink World magazine news, insights and analysis in your Google Search and AI experiences.

Add Ink World magazine as a preferred source on Google (opens in a new tab)

Keep Up With Our Content. Subscribe To Ink World magazine Newsletters